The purpose of this award is to encourage and recognize scientists and engineers relatively early in their careers who are achieving distinguished results in the field of analytical science and technology. We cordially invite applications from researchers all over the world who are enthusiastically engaged in original research and development at universities or public research facilities.
We are looking for advanced analysis and measurement technologies that can contribute process control for semiconductor manufacturing process, especially deposition and etch processes.
The monitoring points are not only the device portion on wafer but also the portion including process chambers and fluid delivery systems that can contribute to device performance improvements, and to achieve high efficiency processes, energy savings and yield improvement.
The target manufacturing processes are IC (logic, memory, analog IC), optical devices (display, LED, solar), discrete devices (diode, power IC) and sensor devices (temperature sensor, pressure sensor) and cannot include research of materials and device characterization.
An applicant should be a researcher or an engineer at a university or a public research facility worldwide, engaged in research and development in the field described above. The applicant should fulfill one of the following criteria:
Potential of the applicant is highly evaluated rather than his/her current achievement.
Applications from outside Japan must be made at the invitation from an employee of a HORIBA Group company.
A certificate of commendation will be presented to each recipient of the 2018 Masao Horiba Awards at the award ceremony.
A supplementary award will also be made. Research subsidy of JPY1,000,000 yen will be presented in the first year and the same amount JPY1,000,000 yen for the next year.
The award and the supplementary award will be given on the condition that the winners accept the invitation to attend the award ceremony held in Kyoto on Oct. 17, 2018 and that the winners continue to meet the eligibility described above.
Applicants are required to submit:
For detailed information, please contact HORIBA office in your region.
Applicants must submit the above original application documents with 1 copy, and a CD-R or DVD to the HORIBA Group company employee who invited them to apply for the award by Friday, May 18, 2018.
Applications are no longer being accepted.
The members of the Screening Committee for the 2018 Masao Horiba Awards listed below will determine the winners through examination of the achievements and future prospects of the applicants, based on their application documents.
Applicants will be notified of the screening results by the end of July, 2018.
Award ceremony and commemorative seminar for the 2018 Masao Horiba Awards, followed by a reception, will be held on October 17, 2018 at Shiran Kaikan, Kyoto University, Kyoto, Japan.
Award-winning research will be published in HORIBA’s technical journal Readout.